Power conversion is a common element in almost every electronic device, implemented in a variety of topologies. This white paper provides the context behind the development of new semiconductor technologies with examples given of innovative parts that are placed to provide the right mix of features for current and emerging power conversion applications.
Wide band-gap semiconductors as high-frequency switches are enablers for better efficiency in power conversion. One example, the silicon carbide switch can be implemented as a SiC MOSFET or in a cascode configuration as a SiC FET. This white paper traces the origins and evolution of the SiC FET to its latest generation and compares its performance with alternative technologies.
Silicon Carbide (SiC) and Gallium Nitride (GaN) semiconductor technologies are promising great performance for the future. SiC devices in a cascode configuration enable existing systems to be easily upgraded to get the benefits of wide band-gap devices right now.
Wide bandgap semiconductors are finding applications in all types of power conversion including in electric vehicles. This white paper explains how the latest-generation SiC FETs are ideally suited to new inverter designs with lower losses than IGBTs and proven robustness against short circuits, even at high temperatures and under repetitive stress.
The benefits of silicon carbide (SiC) devices for use in power electronics are driven by fundamental material benefits of high breakdown field and thermal conductivity, and over 25 years of sustained development in materials and devices has brought adoption to a tipping point.
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